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OLED Production Systems

Hitachi Zosen offers high-productivity OLED production systems with planar evaporation sources adopting multi-nozzles. We supply static evaporation sources as well as traversing evaporation linear sources for large substrates. Furthermore, we propose, design, and manufacture various equipment for trial production and material development of OLED devices. Not only small deposition machines with a single deposition chamber but also large cluster systems with multiple chambers for evaporating and substrate transferring.

Major products

Planar evaporation source for OLED mass production systems


  • Good uniformity without any movement of the substrate or source (thickness uniformity; ≤ ±3%, ±1% is also available)
  • High material yield (material utilization rate: ≥ 40% for G4 substrates)
  • Value rate control to realize stable & proper deposition (deposition rate: 10 A/sec ±1%)
  • Minimum of moving parts in chamber to minimize particle generation
  • Can be equipped with a quick material changing mechanism during deposition (suitable for extended continuous operation, preventing degradation of organic materials)
  • Side and down deposition are available.
  • Accepts large substrates

Diverted planar evaporation source with substrate traversing for OLED production systems


  • Linear source, which is diverted planar source, to achive stable evaporation rate and good uniformity by flux control valve
  • High material yield
    (material utilization rate: ≥ 60% for 300mm width substrate)
  • Valve closing during non-evaporation time to save organic material consumption
  • Stable mixing ratio of host and guest materials during co-evaporation without decreasing material utilization by Stacking type Manifold of the source
  • Mounted Hitz original evaporation rate sensor for long time continuous operation instead of QCM

OLED evaporation machine (for R&D)


Improved trial production
Configuration allows per-batch processing to enable deposition of varying organic material patterns and different thick film patterns on the substrate.
Various types of evaporation sources are possible
The organic material evaporation source is a small resistance heating crucible that saves space while delivering a balanced mixture onto the substrate during co-evaporation.
Low substrate temperature
The substrate holder features an internal water-cooling mechanism to maintain substrates at the required temperature.
Good uniformity of film thickness
The substrate rotating mechanism ensures uniform distribution of film thickness over the entire substrate surface.
Chuck mechanism between substrate and mask
The substrate insertion and mask forming processes have been enhanced to ensure optimum alignment between mask and substrates.
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