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OLED Production Systems

Hitachi Zosen offers high-productivity OLED production systems with a plane evaporation source, adopting the multi-aperture method and unique simulation and vacuum technologies. We also supply systems for large substrates. Furthermore, we propose, design, and manufacture various items of deposition equipment for trial production of OLED devices and material development. We can provide various types of equipment from small deposition machines with a single deposition chamber to clusters of large deposition machines consisting of multiple chambers for deposition and carrying.

Major products

Planar evaporation source for OLED display production systems
(Planar evaporation source for mass production systems)


  • Good uniformity without any movement of the substrate or source (thickness uniformity; ≤ ±3%, ±1% is also available)
  • High material yield (material utilization rate: ≥ 40% for G4 substrates)
  • Value rate control to realize stable & proper deposition (deposition rate: 10 A/sec ±1%)
  • Minimum of moving parts in chamber to minimize particle generation
  • Can be equipped with a quick material changing mechanism during deposition (suitable for extended continuous operation, preventing degradation of organic materials)
  • Side and down deposition are available.
  • Accepts large substrates

OLED evaporation machine (for R&D)


Improved trial production
Configuration allows per-batch processing to enable deposition of varying organic material patterns and different thick film patterns on the substrate.
Various types of evaporation sources are possible
The organic material evaporation source is a small resistance heating crucible that saves space while delivering a balanced mixture onto the substrate during co-evaporation.
Low substrate temperature
The substrate holder features an internal water-cooling mechanism to maintain substrates at the required temperature.
Good uniformity of film thickness
The substrate rotating mechanism ensures uniform distribution of film thickness over the entire substrate surface.
Chuck mechanism between substrate and mask
The substrate insertion and mask forming processes have been enhanced to ensure optimum alignment between mask and substrates.
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